Insert Molded Device Housings for Portable Electronic Devices

ABSTRACT

Improved techniques for forming an electronic device housing in which an outer housing member can be assembled with one or more other housing members of the electronic device are disclosed. The one or more other housing members can together with a thin substrate layer (or thin substrate) form a frame to which the outer housing member can be secured. The thin substrate layer facilitates molding of the one or more other housing members adjacent to the outer housing member. In one embodiment, the outer housing member can be made of glass and the one or more other housing members can be made of a polymer, such as plastic. The substrate layer can, for example, be formed of a polymer or a metal. The resulting electronic device housing can be thin yet be sufficiently strong to be suitable for use in electronic devices, such as portable electronic devices.

BACKGROUND

Conventionally, small form factor devices, such as handheld electronicdevices, have a display arrangement that includes various layers. Thevarious layers usually include at least a display technology layer, andmay additionally include a sensing arrangement and/or a cover windowdisposed over the display technology layer. By way of example, thedisplay technology layer may include or pertain to a Liquid CrystalDisplay (LCD) that includes a Liquid Crystal Module (LCM). The LCMgenerally includes an upper glass sheet and a lower glass sheet thatsandwich a liquid crystal layer therebetween. The sensing arrangementmay be a touch sensing arrangement such as those used to create a touchscreen. For example, a capacitive sensing touch screen can includesubstantially transparent sensing points or nodes dispersed about asheet of glass (or plastic). In addition, the cover window, which istypically designed as the outer protective barrier of the layer stack.Conventionally, supporting a cover window and the LCM have used aninternal flange but such impedes the ability to make devices thinner andmay also impede usage of a peripheral area of the cover window

SUMMARY

The invention relates generally to an electronic device housing in whichan outer housing member can be assembled with one or more other housingmembers of the electronic device. The one or more other housing memberscan together with a thin substrate layer (or thin substrate) form aframe to which the outer housing member can be secured. The thinsubstrate layer facilitates molding of the one or more other housingmembers adjacent to the outer housing member. In one embodiment, theouter housing member can be made of glass and the one or more otherhousing members can be made of a polymer, such as plastic. The substratelayer can, for example, be formed of a polymer or a metal. The resultingelectronic device housing can be thin yet be sufficiently strong to besuitable for use in electronic devices, such as portable electronicdevices.

The invention can be implemented in numerous ways, including as amethod, system, device, or apparatus. Several embodiments are discussedbelow.

As a method for assembling a device housing of an electronic device, oneembodiment can, for example, include at least: providing an outerhousing member for a first portion of the device housing; providing athin film for an internal structural member of the device housing;securing together the outer housing member and the thin film; andmolding an outer molded member for a second portion of the devicehousing against a surface of the thin film and against at least asurface of the outer housing member. In one implementation, the outerhousing member can be a glass outer housing member.

As an electronic device having a device housing including an outerhousing member, the device housing can be formed in accordance with amethod. In one embodiment, the method can, for example, include atleast: providing the outer housing member for a first portion of thedevice housing; providing a thin film for an internal structural memberof the device housing; securing together the outer housing member andthe thin film; and molding an outer molded member for a second portionof the device housing against a surface of the thin film and against atleast a surface of the outer housing member.

As an electronic device enclosure, one embodiment can, for example,include at least a thin substrate, and a glass cover window for a topsurface for the electronic device enclosure. The glass cover window canbe secured to the thin substrate. The embodiment of the electronicdevice can also include at least one molded side member for a sidesurface for the electronic device enclosure. The at least one moldedside member can be molded adjacent to the thin substrate and adjacent toat least one side surface of the glass cover window.

As a method for assembling a device housing of an electronic device, oneembodiment can, for example, include at least the operations of:providing an outer housing member for a first portion of the devicehousing; providing a thin metal substrate for an internal structuralmember of the device housing, the thin metal substrate having a centralopening, the central opening corresponding to a significant portion ofthe outer housing member; securing together the outer housing member andthe thin metal substrate, the central opening in the thin metalsubstrate being aligned with the outer housing member; and molding anouter molded member for a second portion of the device housing against asurface of the thin metal substrate and against at least a surface ofthe outer housing member.

Other aspects and advantages of the invention will become apparent fromthe following detailed description taken in conjunction with theaccompanying drawings which illustrate, by way of example, theprinciples of the invention.

BRIEF DESCRIPTION OF THE DRAWINGS

The invention will be readily understood by the following detaileddescription in conjunction with the accompanying drawings, wherein likereference numerals designate like structural elements, and in which:

FIG. 1 is a flow diagram of a process for forming a housing for anelectronic device according to one embodiment.

FIG. 2 is a flow diagram of a process for forming a housing for anelectronic device according to one embodiment.

FIGS. 3A-3F are diagrams illustrating assembly of a portion of anelectronic device housing according to one embodiment.

FIGS. 4A-4C are diagrammatic representations of electronic deviceaccording to another embodiment of the invention.

FIG. 5A is a cross-sectional diagram of a glass cover for an electronicdevice housings according to an embodiment that pertains to a chamferededge geometry.

FIG. 5B illustrates a cross-sectional diagram of a glass cover having anedge geometry.

DETAILED DESCRIPTION OF EMBODIMENTS OF THE INVENTION

The invention relates generally to an electronic device housing in whichan outer housing member can be assembled with one or more other housingmembers of the electronic device. The one or more other housing memberscan together with a thin substrate layer (or thin substrate) form aframe to which the outer housing member can be secured. The thinsubstrate layer facilitates molding of the one or more other housingmembers adjacent to the outer housing member. In one embodiment, theouter housing member can be made of glass and the one or more otherhousing members can be made of a polymer, such as plastic. The substratelayer can, for example, be formed of a polymer or a metal. The resultingelectronic device housing can be thin yet be sufficiently strong to besuitable for use in electronic devices, such as portable electronicdevices.

The following detailed description is illustrative only, and is notintended to be in any way limiting. Other embodiments will readilysuggest themselves to skilled persons having the benefit of thisdisclosure. Reference will now be made in detail to implementations asillustrated in the accompanying drawings. The same reference indicatorswill generally be used throughout the drawings and the followingdetailed description to refer to the same or like parts. It should beappreciated that the drawings are generally not drawn to scale, and atleast some features of the drawings have been exaggerated for ease ofillustration.

In the interest of clarity, not all of the routine features of theimplementations described herein are shown and described. It will, ofcourse, be appreciated that in the development of any such actualimplementation, numerous implementation-specific decisions must be madein order to achieve the developer's specific goals, such as compliancewith application and business related constraints, and that thesespecific goals will vary from one implementation to another and from onedeveloper to another. Moreover, it will be appreciated that such adevelopment effort might be complex and time-consuming, but wouldnevertheless be a routine undertaking of engineering for those ofordinary skill in the art having the benefit of this disclosure.

Embodiments of the invention can relate to apparatus, systems andmethods for forming a housing having a thin glass member for anelectronic device. In one example, the glass member may be an outersurface of an electronic device. The glass member may for examplecorrespond to a glass cover that helps form part of a display area of anelectronic device (i.e., situated in front of a display either as aseparate part or integrated within the display. Alternatively oradditionally, the glass member may form a part of the housing. Forexample, it may form an outer surface other than in the display area.

The apparatus, systems and methods for improving strength of thin glassare especially suitable for glass covers, or displays (e.g., LCDdisplays), assembled in small form factor electronic devices such ashandheld electronic devices (e.g., mobile phones, media players,personal digital assistants, remote controls, etc.). The glass can bethin in these small form factor embodiments, such as less than 3 mm, ormore particularly between 0.5 and 2.5 mm, or even more particularlybetween 0.3 and 1.0 mm. The apparatus, systems and methods can also beused for glass covers or displays for other devices including, but notlimited to including, relatively larger form factor electronic devices(e.g., portable computers, tablet computers, displays, monitors,televisions, etc.). The glass can also be thin in these larger formfactor embodiments, such as less than 5 mm, or more particularly between0.5 and 3 mm, or even more particularly between 0.3 and 2.0 mm.

Embodiments are discussed below with reference to FIGS. 1-5B. However,those skilled in the art will readily appreciate that the detaileddescription given herein with respect to these figures is forexplanatory purposes as the invention extends beyond these limitedembodiments.

FIG. 1 is a flow diagram of a process 100 for forming a housing for anelectronic device according to one embodiment. The process 100 canprovide 102 an outer housing member for a portion of a device housing.In one embodiment, the outer housing member is formed of glass. A thinfilm that is to act as an internal structural member can be provided104. The outer housing member can be secured 106 to at least a portionof the thin film. For example, a layer of adhesive can be providedbetween the outer housing member and the portion of the thin film tosecure 106 the outer housing member to the portion of the thin film.Thereafter, an outer molded member that serves as another portion of thedevice housing can be molded 108 (e.g., insert-molded) against the thinfilm and the outer housing member.

Through use of a thin substrate layer, the housing can support an outerhousing member around which other portions of the housing can be formed.The outer housing member is, for example, a glass member. The outermolded member can be formed of a polymer, such as plastic, and canoptionally be optically clear at least at some of the portions.

The thin film and the outer molded member can be formed from any of avariety of materials. For example, the polymers, such as plastics (e.g.,polycarbonate), acrylic or nylon. In one embodiment, the thin filmand/or the outer molded member can be translucent or substantiallytranslucent. When the outer housing member is an outer glass member, thethin film can be transparent (i.e., clear) so that a display module canbe adjacent the thin film and remain viewable through the outer glassmember and the thin film. The outer molded member can, if desired, alsobe formed from transparent materials. Once molded, the outer moldedmember can tightly abut against a least one side of the outer glassmember. Since both the outer glass member and the outer molded membercan be translucent (i.e., clear), these members can visually blendtogether at the interface therebetween.

FIG. 2 is a flow diagram of a process 200 for forming a housing for anelectronic device according to one embodiment. The process 200 canprovide an outer glass member for a device housing. A thin film (i.e.,thin film substrate) can provide an internal structural member for thedevice housing. A cosmetic layer can be placed 206 on a portion of thethin film. For example, the cosmetic layer can be placed 206 on only aperipheral region of the thin film. For example, the cosmetic layer canprovide a mask to render housing portions internal to the device housingto be hidden. The cosmetic layer can be opaque or partially translucent.In one embodiment, the cosmetic layer can be provided as a thin coat,for example, a coating of about 0.1-0.3 mm. In one implementation, thethin coating can be about 0.15 mm thick and be deposited on the thinfilm. For example, the thin coating can be sprayed on or printed ontothe surface of the thin film.

Next, the outer glass member can be affixed 208 to the thin film. In oneimplementation, an optically clear adhesive can be used to affix 208 theouter glass member to the thin film. Here, the outer glass member can betransparent (i.e., clear) so that the device housing can allow a displaydevice provided inside the device housing to be viewed by a user of theelectronic device. Hence, at least to the extent that the outer glassmember is adjacent or over the thin film, the thin film can also betransparent (i.e., clear). As such, the display device is visiblethrough the outer glass member, the optically clear adhesive, and thethin film. After the outer glass member has been affixed 208 to the thinfilm, an outer molded member can be insert molded 210 against the thinfilm and the outer glass member. Although insert molding of material,such as polymers, into an outer molded member adjacent the outer glassmember suffers from poor adhesion because the molded material poorlyadheres to glass. However, the presence of the thin film can be formedfrom a polymer and can thus strongly adhere to the molded material. Thethin film thus serves to secure and retain the outer glass member to theouter molded material. The outer glass member can also include one ormore edge features to assist in securing the outer glass member to theouter molded material. However, given that the outer glass member isthin, such as less than 3 mm, the ability to provide significantretention features is limited.

FIGS. 3A-3F are diagrams illustrating assembly of a portion of anelectronic device housing according to one embodiment.

FIG. 3A is a diagram of an exemplary outer glass member 300. The outerglass member 300 is a glass piece that is sized to fit as a top outersurface for some portion of an electronic device housing. The thicknessof the outer glass member 300 can vary with implementation, but for mostembodiments using thin glass pieces, the thickness is about 0.4-3millimeters (mm). More specifically, for one particular example usefulfor a handheld electronic device, the thickness of the thin glass isabout 0.5-1 mm. The outer glass member 300 includes a top surface 302, abottom surface 304, a left surface 306 and a right surface 308.

FIG. 3B is a diagram of an exemplary thin film member 320. Once theelectronic device housing is assembled, the thin film member 320 servesas a substrate for at least the outer glass member 300. The thin film isthin and transparent. The thickness of the thin film member 320 can varywith implementation, but for most embodiments using thin glass pieces,the thickness is about 0.05-0.5 millimeters (mm). More specifically, forone particular example useful for a handheld electronic device, thethickness of the thin film member 320 is about 0.1-0.2 mm, such as 0.15mm. The thin film member 320 includes a top surface 322 and a bottomsurface 324.

FIG. 3C is a diagram of the exemplary film member 320 illustrated inFIG. 3B after a cosmetic layer 340 is deposited. In this embodiment, thecosmetic layer 340 is deposited on a portion of the top surface 322 ofthe film member 320. For example, the cosmetic layer 340 can bedeposited using a printing technique. The cosmetic layer 340 is thin andtransparent. The thickness of the cosmetic layer 340 can vary withimplementation but for most embodiments, the thickness is 0.05-1.5millimeters (mm). More specifically, for one particular example usefulfor a handheld electronic device, the thickness of the cosmetic layer340 is about 0.1 mm.

FIG. 3D is a diagram of an exemplary assembly 360 according to oneembodiment. The exemplary assembly 360 attached the outer glass member300 to the thin film 322. In particular, the bottom surface 304 of theouter glass member 300 can be attached to the top surface 322 of thethin film member 320. A layer of adhesive 362 is provided between theouter glass member 300 and the thin film 320 so as to secure the outerglass member 300 to the thin film 320. Once assembled, the cosmeticlayer 340 can be provided adjacent the periphery of the outer glassmember 300.

FIG. 3E is a diagram of the exemplary assembly 360 illustrated in FIG.3D after an outer molded member 380 is formed (i.e., molded) to theassembly 360. The outer molded member 380 can be molded adjacent the topsurface 322 of the thin film member 320 and also adjacent to the rightsurface 308 of the outer glass member 300.

FIG. 3F is a diagram of the exemplary assembly 360 illustrated in FIG.3E after an outer molded member 390 is formed (i.e., molded) to theassembly 360. The outer molded member 390 can be molded adjacent the topsurface 322 of the thin film member 320 and also adjacent to the leftsurface 306 of the outer glass member 300.

FIGS. 4A-4C are diagrammatic representations of electronic device 400according to another embodiment of the invention. FIG. 4A illustrates atop view for electronic device 400, and FIG. 4B illustrates across-sectional side view for electronic device 400 with respect toreference line B-B′. FIG. 4C illustrates an expanded cross-sectionalside view for electronic device 400 with respect to reference line B-B′.Electronic device 400 shown in FIGS. 4B and 4C are the samecross-sectional view for electronic device 400, though the illustrationin FIG. 4C is expanded to facilitate ease of understanding.

Electronic device 400 can include housing 402 that has glass coverwindow 404 (glass cover) as a top surface. In this embodiment, coverwindow 404 can be protected by side surfaces 403 of housing 402. Sidesurfaces 403 can be adjacent to the outer surface of cover window 404.Side surfaces 403 can be integral with housing 402, or side surface 403could be separate from housing 402 and, for example, operate as a bezelfor cover window 404. Side surfaces 403 can be molded adjacent to thinfilm 706 that is provided below cover window 404. Cover window 404 is atleast primarily transparent so that display assembly 408 is visiblethrough cover window 404. Display assembly 408 can, for example, bepositioned adjacent cover window 404. Housing 402 can also containinternal electrical components besides display assembly 408, such as acontroller (processor), memory, communications circuitry, etc. Displayassembly 408 can, for example, include a LCD module. By way of example,display assembly 408 may include a Liquid Crystal Display (LCD) thatincludes a Liquid Crystal Module (LCM). In one embodiment, cover window404 is integrally formed with the LCM. Housing 402 can also include anopening 410 for containing the internal electrical components to provideelectronic device 400 with electronic capabilities. Within opening 410are one or more internal structures 414 that can support or securedisplay assembly 408 or that can provide attachment features forsupporting or securing other components internal to opening 410.

The front surface of electronic device 400 can also include userinterface control 412 (e.g., click wheel control). In this embodiment,cover window 404 does not cover the entire front surface of electronicdevice 400. Electronic device 400 essentially includes a partial displayarea that covers a portion of the front surface.

Cover window 404 may generally be arranged or embodied in a variety ofways. By way of example, cover window 404 may be configured as aprotective glass piece that is positioned over an underlying display(e.g., display assembly 408) such as a flat panel display (e.g., LCD) ortouch screen display (e.g., LCD and a touch layer). Alternatively, coverwindow 404 may effectively be integrated with a display, i.e., glasswindow may be formed as at least a portion of a display. Additionally,cover window 404 may be substantially integrated with a touch sensingdevice such as a touch layer associated with a touch screen. In somecases, cover window 404 can serve as the outer most layer of thedisplay.

As noted above, the electronic device can be a handheld electronicdevice or a portable electronic device. Embodiments of the invention canserve to enable a glass cover to be not only thin but also supported ina space efficient manner. As such, the invention is well suited forimplementation of glass surfaces for handheld electronic device or aportable electronic device that are designed to be thin.

The glass cover (or cover window) is particularly useful for thin glassapplications. For example, the thickness of a glass cover can be betweenabout 0.5-2.5 mm. More specifically, the glass cover can have athickness is less than about 2 mm, or even thinner than about 1 mm, orstill even thinner than about 0.8 mm.

In one embodiment, the size of the glass cover depends on the size ofthe associated electronic device. For example, with handheld electronicdevices, the size of the glass cover is often not more than five (5)inches (about 12.7 cm) diagonal. As another example, for portableelectronic devices, such as smaller portable computers or tabletcomputers, the size of the glass cover is often between four (4) (about10.2 cm) to twelve (12) inches (about 30.5 cm) diagonal. As stillanother example, for portable electronic devices, such as full sizeportable computers, displays or monitors, the size of the glass cover isoften between ten (10) (about 25.4 cm) to twenty (20) inches (about 50.8cm) diagonal or even larger.

However, it should be appreciated that with larger the screen sizes, thethickness of the glass layers may need to be greater. The thickness ofthe glass layers may need to be increased to maintain planarity of thelarger glass layers. While the displays can still remain relativelythin, the minimum thickness may increase with increasing screen size.For example, the minimum thickness of the glass cover can correspond toabout 0.4 mm for small handheld electronic devices, about 0.6 mm forsmaller portable computers or tablet computers, about 1.0 mm or more forfull size portable computers, displays or monitors, again depending onthe size of the screen. The thickness of the glass cover can depend onthe application and/or the size of electronic device.

FIG. 5A is a cross-sectional diagram of a glass cover 500 for anelectronic device housings according to an embodiment that pertains to achamfered edge geometry. More particularly, FIG. 5A illustrates across-sectional diagram of glass cover 500 having edge geometry 502. Thethickness (t) for the glass cover is about 1.0 millimeter. Edge geometry502 has flattened edges. Edge geometry 502 is effectively a chamferededge. A chamfer is a beveled edge that substantially connects two sidesor surfaces. In one embodiment, a chamfered edge may have a depth ofbetween approximately 0.15 millimeters and approximately 0.25millimeters. By way of example, edge geometry 502 may include anapproximately 0.15 millimeter chamfer or an approximately 0.25millimeter chamfer.

Using chamfered edges on an outer housing member, such as a glass cover,can serve to assist with retention of the outer housing member. Inparticular, the chamfers act as retention features on the sides of theouter housing member once molded outer members are formed (e.g., throughinjection molding) adjacent to such sides.

FIG. 5B illustrates a cross-sectional diagram of a glass cover 520having an edge geometry 522, such as a rounded edge geometry. In oneembodiment, the thickness (t) for the glass cover is about 1.0millimeter, although it should be appreciated that thickness (t) mayvary. In one embodiment, edge geometry 522 can have an edge radius (r)of, for example, about 0.3 millimeters, although it should beappreciated that edge radius (r) may vary. More generally, the edges ofthe edge geometry 522 can be rounded to an edge radius of 10-50% of thethickness of the cover glass.

In general, the steps associated with the methods of the presentinvention may vary widely. Steps may be added, removed, altered,combined, and reordered without departing from the spirit or the scopeof the present invention.

Although the above discussion with respect to FIGS. 1-5B is primarilyconcerned with embodiments of a display housing employing a thin filmsubstrate. In other embodiments, a thin metal substrate can instead beused. The thin metal substrate can, for example, be formed of steel(e.g., stainless steel) or aluminum. The thin metal substrate is thin asis the thin film substrate and can be attached and used in the samemanner. However, since metal is opaque, an opening is provided in thethin metal substrate so that an outer housing member (e.g., coverwindow) that is transparent can be used to view a display assemblyprovided within the device housing. The thin metal film can provide aviewable display area border that is opaque but includes an opening forviewing the display assembly.

The various aspects, features, embodiments or implementations of theinvention described above may be used alone or in various combinations.

While this specification contains many specifics, these should not beconstrued as limitations on the scope of the disclosure or of what maybe claimed, but rather as descriptions of features specific toparticular embodiment of the disclosure. Certain features that aredescribed in the context of separate embodiments may also be implementedin combination. Conversely, various features that are described in thecontext of a single embodiment may also be implemented in multipleembodiments separately or in any suitable subcombination. Moreover,although features may be described above as acting in certaincombinations, one or more features from a claimed combination can insome cases be excised from the combination, and the claimed combinationmay be directed to a subcombination or variation of a subcombination.

While embodiments and applications have been shown and described, itwould be apparent to those skilled in the art having the benefit of thisdisclosure that many more modifications than mentioned above arepossible without departing from the inventive concepts herein.

1. A method for assembling a device housing of an electronic device,said method comprising: providing an outer housing member for a firstportion of the device housing; providing a thin film for an internalstructural member of the device housing; securing together the outerhousing member and the thin film; and molding an outer molded member fora second portion of the device housing against a surface of the thinfilm and against at least a surface of the outer housing member.
 2. Amethod as recited in claim 1, wherein the outer housing member is aglass outer housing member, and wherein the thickness of the outerhousing member is about 0.4-2.5 mm.
 3. A method as recited in claim 1,wherein the thickness of the outer housing member is not more than about1 mm.
 4. A method as recited in claim 1, wherein the thickness of thethin film is about 0.1-0.5 mm.
 5. A method as recited in claim 1,wherein the thin film is formed from a clear polymer.
 6. A method asrecited in claim 1, wherein the securing comprises: providing a layer ofadhesive on a surface of the outer housing member or on a surface of thethin film; and placing at least the portion of the thin film against theportion of the outer housing member, with the layer of adhesivetherebetween serving to secure together the outer housing member and thethin film.
 7. A method as recited in claim 6, wherein the layer ofadhesive is a clear adhesive.
 8. A method as recited in claim 1, whereinthe electronic device is a handheld electronic device.
 9. A method asrecited in claim 1, wherein the outer housing member includes at least atop surface, and a bottom surface, wherein the thin film includes atleast a top surface and a bottom surface, and wherein the securingcomprises: securing at least a portion of the bottom surface of theouter housing member to at least a portion of the top surface of thethin film.
 10. A method as recited in claim 9, wherein the securingcomprises depositing a layer of adhesive on the bottom surface of theportion of the outer housing member or the portion of the top surface ofthe thin film.
 11. A method as recite in claim 1, wherein the methodcomprises: depositing a cosmetic layer on at least a portion of the thinfile.
 12. A method as recite in claim 1, wherein the method comprises:printing a layer of ink on at least a portion of the thin film.
 13. Amethod as recited in claim 1, wherein the outer molded member isoptically clear.
 14. A method as recited in claim 1, wherein the thinfilm at least partially secures the outer housing member to the outermolded member.
 15. An electronic device having a device housingincluding an outer housing member, the device housing being formed bythe method of: providing the outer housing member for a first portion ofthe device housing; providing a thin film substrate for an internalstructural member of the device housing; securing together the outerhousing member and the thin film substrate; and molding an outer moldedmember for a second portion of the device housing against a surface ofthe thin film substrate and against at least a surface of the outerhousing member.
 16. An electronic device as recited in claim 15, whereinthe outer housing member is a glass outer housing member.
 17. Anelectronic device enclosure, comprising: a thin substrate; a glass coverwindow for a top surface for the electronic device enclosure, the glasscover window being secured to the thin substrate; and at least onemolded side member for a side surface for the electronic deviceenclosure, the at least one molded side member being molded adjacent toat least a portion of the thin substrate and adjacent to at least oneside surface of the glass cover window.
 18. An electronic deviceenclosure as recited in claim 17, wherein the thickness of the glasscover window is about 0.4-2.5 mm.
 19. An electronic device enclosure asrecited in claim 18, wherein the thickness of the thin substrate isabout 0.1-0.5 mm.
 20. An electronic device enclosure as recited in claim17, wherein the electronic device enclosure further comprises: aninternal structure provided internal to the electronic device enclosure,the internal structure being secured to an inner surface of the at leastone molded side member.
 21. An electronic device enclosure as recited inclaim 17, wherein the electronic device enclosure comprises: a LCDmodule provided internal to the electronic device enclosure and adjacenta bottom surface of the thin film.
 22. An electronic device enclosure asrecited in claim 17, wherein the width of the LCD module can besubstantially the same as the width of the outer housing member.
 23. Anelectronic device enclosure as recited in claim 17, wherein the outerhousing member can be secured to the device housing without requiring aninternal support flange that blocks and thus renders unusablesignificant peripheral portions of a bottom surface of the outer housingmember.
 24. An electronic device enclosure as recited in claim 17,wherein the outer housing member comprises glass, and wherein the atleast one molded side member comprises optically clear plastic.
 25. Anelectronic device as recited in claim 17, wherein the thin substrate isformed of a polymer.
 26. An electronic device as recited in claim 17,wherein the thin substrate is formed of a metal having an openingadjacent a central region of the glass cover window.
 27. A method forassembling a device housing of an electronic device, said methodcomprising: providing an outer housing member for a first portion of thedevice housing; providing a thin metal substrate for an internalstructural member of the device housing, the thin metal substrate havinga central opening, the central opening corresponding to a significantportion of the outer housing member; securing together the outer housingmember and the thin metal substrate, the central opening in the thinmetal substrate being aligned with the outer housing member; and moldingan outer molded member for a second portion of the device housingagainst a surface of the thin metal substrate and against at least asurface of the outer housing member.
 28. A method as recited in claim27, wherein the outer housing member is a glass outer housing member.29. A method as recited in claim 27, wherein the thickness of the outerhousing member is not more than about 1 mm.
 30. A method as recited inclaim 27, wherein the thickness of the thin metal substrate is about0.1-0.5 mm.